Softbank has revealed through one of its accounting reports that Qualcomm’s new integrated circuit will come with the Modem 5G SDX50, which together with the application processor SDM855 will be known as the Snapdragon 855 Fusion Platform. While the Qualcomm Snapdragon 845 processor is coming to market in the new high-end devices, Qualcomm Snapdragon 855 is already in development, and the rumors do not stop being a processor that promises a lot in the field of what now seems to be more than just Smartphones.
The Snapdragon processors are diversifying every day!
This change from ‘Mobile Platform’ to ‘Fusion Platform’ could be due to the diversification of Snapdragon processors, which increasingly ceases to be exclusive of smartphones.
On the other hand, the presentation also mentions that companies such as Samsung or Nokia will begin to implement ‘Massive MIMO Sites in 2023‘, MIMO refers to a wireless technology that allows the transmission of data faster between users and with less loss of data. This technology is expected to reach markets around the world during 2019.
The Snapdragon 855 Fusion Platform will have a processor with a manufacturing process of 7 nanometers
The Snapdragon 855 Fusion Platform will have a 7nm processor, the first in the world, this means – from a very general scope – that the processor will perform better using less energy, and the difference is remarkable, since the Snapdragon 845 has a manufacturing process of 10 nm.
It has also been revealed that TSMC (Taiwan Semiconductor Manufacturing Company) will be responsible for the manufacture of this new Qualcomm platform, which means a change in relation to the previous processors which were being manufactured by Samsung.