Intel is making introducing a system whereby a modern CPU into individual stackable chips. The company desires to offer products built on Foveros 3D stacking in 2024. This will be an industry’s first chance of stacking processing components inside a chip.
Now that the fat of stacking memory is accomplished, Intel wants to do something close to that with the CPU. The company will allow designers to add their own quota to the ship. The result will be that from now on, separate chiplets will make up power regulation, graphics, and AI processing at the on-die memory. Some of these chiplets will be stacked on top one another.
This move will make it possible for Intel to scale one of its greater hurdles of being able to build full chips at 10nm level.
The company’s previous experience with 10nm road maps have frequently been a failure, thereby presenting great challenges to Intel’s engineering and technological development department. The challenge really had to do with the chiplet development.
In the middle of all this, a report arose that Intel had stopped its 10nm plans but the company came out to debunk the story, calling it false. Intel also said that it was making good process with the 10nm chiplet development.
On the other hand, the company also hinted at ding something it called 2D stacking. This, according to Intel will be a separation of various processor components into smaller parts. Each of these could be manufactured using different production node.
In this way, Intel may deliver 10nm CPU and also vary that with 14nm and 22nm chiplet modules in among.
The chipmaker too has made some promises about improving latency and allowing execution of more operations in parallel.
On the graphics front, Intel also wants to break new barriers by maintaining new Gen 11 integrated graphics that will break the 1 TFLOPS barrier.
Also, the company is looking to introduce a new graphics processor by 2020. However, the executives at Intel also intimated that from mobile devices to the data center will feature Foveros processors over time starting from the second half of 2019.
